Features
Excellent programming performance
- Cutting-edge programming core delivers the fastest and most stable programming performance
on high-density NAND Flash and eMMC
- Full IC pin contact check prevents bad contact in socket or IC damage from reversed placement
Support wide range of IC devices and packages
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Device supported: UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM,
SPI Memory, FPGA, CPLD, etc.
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Package supported: DIP, QFP, QFN, SON, BGA, WLCSP, etc.
High data transfer speed
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USB3.1 Gen 1 (USB3.0) transferring interface significantly increase the programming speed
Brand-new software interface
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Intuitive graphical user interface
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Clear display of each function in the entire programming procedure
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Display details and status of each device during programming
Timely software support
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Fast software support by customer’s request
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The supporting software is updated weekly on HI-LO website for checking or retrieving
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All programming problems will be followed and handled immediately
ALL-300S Core
ALL-300S Core
New generation high-performance core：
New design of high-performance hardware,
provides high speed and quality on eMMC or high density NAND Flash programming
- Support latest IC devices and over 95% of MCU IC in market
- Full IC pin contact check prevents bad contact in socket or IC damage from reversed placement
- With new generation programming core,
ALL-300S provides three times faster than other programmer in eMMC programming
Industries
This product is used in mobile, automotive, and consumer electronics
industries.
