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AT3-310A4

AT3-370AL Automated Programming Systtem

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Category: Automated IC System

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Features

Excellent performance
  • Up to 2500 UPH with 4 nozzles
  • Equipped with 6~8 units of ALL-200G or ALL-300G2 programmers. 16-128 devices can be programmed simultaneously
  • Minimize the jam rate as well as the possibility of lead bent during handling
  • Capable of handling as small as 1.5mm x 1.5mm devices such as WLCSP
IC devices IC devices
Support wide range of IC devices and packages
  • Device supported: UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM, SPI Memory, FPGA, CPLD, etc.
  • Package supported: DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.
IC devices
Precise vision positioning system
  • Arm camera (1.3M pixels) for socket positioning
  • Fixed camera (3M pixels) for IC pick & place positioning
  • Optional AOI for 2D/3D inspection of IC appearance
Vision
Smart operating software
  • All setup data such as IC type, socket type, and position are saved automatically to achieve zero changeover time
  • User friendly operating interface minimize the possibility of misoperation
  • Provides detailed information of machine status, production status, warning, etc.
  • Detailed production reports and log files are saved for traceability
Smart-operating
Intelligent function setup
    Laser displacement sensor: Automated height calibration of picking IC (Z-axis)
  • Automated IC pick & place positioning reduces the changeover time to 15 minutes or less
HiLoNET (MES)
  • One-Click Start: Operators can start production simply by scanning the barcode, significantly eliminating human errors
  • E-Board: Visualize and update production statistics (Yield rate, UPH, the condition of sockets, etc.) promptly for management to track anytime
  • Program Track System(PTS): Completely record every order from end to end throughout the production process and provide valid statistics for management, realizing statistical process control (SPC)
  • Flexible I/O options
    • Support package conversion between tape, tray, and tube
    IOchange

I/O Devices/Optional

I/O Devices
Auto tray - 535M

Auto tray – 535M

Tape-out - 512M

Tape-out – 512M

Tape-in

Tape-in

Tube-in/Tube-out

Tube-in/Tube-out

Optional
Mark-346

Mark-346

Inkjet-373

Inkjet-373

Laser Marker

Laser Marker

2D/3D Inspection System

2D/3D
Inspection System

ALL-300G2 Core

ALL-300G2 Core

New generation high-performance core: New design of high-performance hardware, provides high speed and quality on UFS, eMMC and high density NAND Flash programming.

  • Support all of latest IC devices and over 95% of MCU IC in market
  • Full IC pin contact check prevents bad contact in socket or IC damage from reversed placement
  • Outstanding speed: Program function delivers 230MB/s and Verify function delivers 880MB/s

ALL-200G Core

ALL-200G Core

The innovative programming core circuit design significantly cuts down programming time of high density memory products, providing high speed, low noise, accurate and reliable programming.

  • Support over 95% of current MCU IC and counting
  • Includes 56 x 8 sets of Precise Universal Pin Driver, each site owns individual Pin Driver so sites are totally independent without interfering each other during multi-site programming
  • 16 bits high freq. core control circuit with high performance FPGA & CPLD
  • Provide high quality programming signals for high speed low power (1.8V) devices

Industries

This product is used in mobile, automotive, and consumer electronics industries.

Resources

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